China Achieves Near-Perfect Lithography with Cryo-ET Process
Researchers in China have made a significant breakthrough in chip manufacturing, reducing defects by 99% using cryo-electron tomography (cryo-ET) to pinpoint sources of manufacturing flaws.
"The team has proposed a solution compatible with existing semiconductor production lines,"
According to Peng, this solution can reduce lithography defects on 12-inch wafers by 99%, resulting in substantial cost benefits to the market. Lithography is a critical step in chip manufacturing, equivalent to "printing circuits" onto semiconductor wafers such as silicon.
- Cryo-ET process achieves unprecedented clarity
- 99% reduction in lithography defects on 12-inch wafers
- Compatible with existing semiconductor production lines
Author's summary: China reduces chip defects by 99% with cryo-ET process.
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