China Achieves Near-Perfect Lithography with Cryo-ET Process
The researchers utilized cryo-electron tomography (cryo-ET) to identify the sources of manufacturing flaws, resulting in unprecedented clarity and a potential pathway to significant industry cost cuts.
According to Peng,
"The team has proposed a solution compatible with existing semiconductor production lines... It can reduce lithography defects on 12-inch (30cm) wafers by 99 per cent,"indicating substantial cost benefits to the market.
Lithography is a critical step in chip manufacturing, equivalent to
"printing circuits" onto semiconductor wafers such as silicon, as described by Peng.
The Cryo-ET process has pinpointed the source of manufacturing flaws, achieving a 99% reduction in chip defects.
Author's summary: China achieves near-perfect lithography.
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